3D IC

Nothing's for Free: Piyush Sancheti on the Real Trade-Offs Behind 3D IC Adoption

From AI accelerators to automotive silicon, what does it actually take — organizationally, economically, and technically — to make 3D IC work in the real world? What you

From Hype to Engineering: How AI Actually Works in 3D IC design

What can AI actually do in 3D IC design today — and what's still science fiction? What you’ll learn… (01:25) Sudarshan's role leading global 3D IC software R&D at Sieme

Beyond the Silo: Managing Data at the Speed of 3D IC Design

What happens when a single untracked design change turns into a multi-billion-dollar public scandal? What you’ll learn... (00:00) Why data — not just design — is the hi

The Wire Problem: Why Advanced Packaging Is the Only Answer Left as Moore's Law Runs Out

What does it take to build a chip when the chip itself is an ecosystem — and the wire connecting everything has become the biggest bottleneck in modern semiconductors? W

From Silos to System: Sujit Sharan on the Cultural and Technical Shift 3D IC Demands

What does it take for one of the world's most complex engineering organisations to commit — fully — to 3D IC as a strategic direction? And what does that commitment revea

The Hidden Time Bomb: Engineering Reliability Into 3D IC From Day One

What happens when reliability can no longer be guaranteed by simply following the rules? What you’ll learn... (01:08) Andras's path from Flomerics and MicReD to Siemens

Beyond the Data Pipe: Why Connectivity IP Is Now the System-Critical Layer in Every 3D IC

What does it actually mean for connectivity IP to stop being a supporting function — and become the layer that determines whether a 3D IC delivers on its promise? What y

From 2.5D to True 3D IC: What’s Driving the Next Wave of Integration

How do you transition from today’s 2.5D systems into tomorrow’s true 3D IC architectures — while balancing cost, performance, and thermal demands? What you’ll learn…

Why Every 3D IC Needs a Test Vehicle Before It Hits Production

How do you ensure that cutting-edge 3D IC designs can actually be manufactured before investing millions in production? What you’ll learn… What test vehicles are and

Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

How do you design and verify a package with tens of millions of pins — without losing months to manual rework? What you’ll learn… Why chiplet-based architectures dema

Why SI/PI is Mission-Critical for 3D IC Success

How do you ensure clean, stable power and reliable signal transmission in a dense 3D IC stack without introducing late-stage surprises? What you’ll learn… What SI/PI me

From Chiplets to Systems: Overcoming the Hidden Pitfalls of 3D IC Design

What does “multiphysics” really mean in 3D IC design—and why is it more important than ever to start early? What you’ll discover: Learn how early predictive multiphys

Why 3D ICs Need a Mindset Shift—and How to Make It Happen

What does it take to turn 3D IC from a buzzword into a successful reality, and how early should you start thinking about system-level planning? Get practical insight int

The Hidden Heat Challenge of 3D ICs—and What Designers Need to Know

Why is thermal analysis no longer an afterthought in 3D IC design—and what is Siemens doing to empower engineers across every step of the process? In this episode of the

Why Traditional PCB Methods Fall Short in 3D IC Design

Why are companies rapidly adopting fan-out wafer-level packaging (FO-WLP)—and how does this shift impact the traditional chip design process? In this episode of the Siem

3D IC is Here—But Is Your Architecture Ready for It?

As 3DIC adoption ramps up, it’s becoming clear: microarchitecture needs a rethink. So how do you design hardware that can survive and thrive in the new era of stacked sil

The Future of 3D ICs: How Advanced Packaging is Changing the Industry

How are 3D Integrated Circuits (3D ICs) revolutionizing semiconductor design, and what role do advanced packaging technologies play in this transformation? In this episo

Uncovering 2.5D and 3D IC Tests

One of the best ways to speed-up product development is to integrate test as early as possible in the design cycle. This shift-left strategy becomes even more critical wh

Getting Started with 3D IC

3D IC designs are complex puzzles that engineers have to solve to achieve high performance and reliability. While vertical stacking gives more design options, it also inc

3D IC Integration Challenges

A common challenge faced when actualizing new technologies such as 3D IC is the lack of specialized tools to mass assemble them. That’s because their designs are normally